TM200

PROUDLY MADE BY

Best in class for

WOOD BASED PANELS

PB/SPB, MDF/HDF, OSB/LSB/FOSB, PLYWOOD, LVL

Measurement is not influenced by vibration or board undulation
Board thickness measured non stop
Reliable, complete and accurate measurements with good repeatability
The board is not damaged in any way by the measurement
Fast moving system to ensure accurate measurement even with high-speed cycles
Incorporated database to store the measurement reports, for statistical analysis and graph printouts
Numerous graphs available such as: boards produced, pressings effected, average thickness, weight and density, for error search and forming line control etc
Network linking possible with different kinds of PLC (Siemens, Allen Bradley, Beckhoff, etc …) based on different protocols such as TCP/IP, OPC UA, Ethercat, etc
Normally installed after single opening, multi-opening or continuous presses.

TECHNICAL DATA
LONGITUDINAL MEASURING POINTS (WIN-LEV)	From 1 to 4
Transversal measuring points	From 1 to 12
Max measurable thickness	50 mm (80 ÷ 120 optional)
Min resolution	1/100 mm
Max error	2/100 mm
Max line speed	210 m/min
Max temperature of the board being measured	180 °C
Max operating temperature of cubicle	40 °C